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LDS8869
PIN DESCRIPTION
Pin #
1
2
3
4
5
6
7
8
9
10
11
12
13, 14
Name
LEDC2
LEDC1
LEDB2
LEDB1
LEDA2
LEDA1
V OUT
V IN
C1+
C1-
C2+
C2-
GND
Function
LEDC2 cathode terminal
LEDC1 cathode terminal
LEDB2 cathode terminal
LEDB1 cathode terminal
LEDA2 cathode terminal
LEDA1 cathode terminal
Charge pump output connected to the LED anodes
Charge pump input, connect to battery or supply
Bucket capacitor 1 Positive terminal
Bucket capacitor 1 Negative terminal
Bucket capacitor 2 Positive terminal
Bucket capacitor 2 Negative terminal
Ground Reference
15
16
TAB
GND
EN/SET
TAB
Ground Reference
Device enable (active high) and Dimming Control
Connect to GND on the PCB
Top view: TQFN 16-lead 3 X 3 mm
PIN FUNCTION
V IN is the supply pin for the charge pump. A small 1 μ F
ceramic bypass capacitor is required between the Vin
pin and ground near the device. The operating input
voltage range is from 2.5V to 5.5V. Whenever the
input supply falls below the under-voltage threshold
(2.2 V), all the LED channels are disabled and the
device enters shutdown mode.
EN/SET is the enable and one wire addressable
control logic input for all LED channels. Guaranteed
levels of logic high and logic low are set at 1.3V and
0.4V respectively. When EN/SET is initially taken
high, the device becomes enabled and all LED
currents remain at 0mA. To place the device into zero
current mode, the EN/SET pin must be held low for
more than 1.5ms.
V OUT is the charge pump output that is connected to
the LED anodes. A small 1 μ F ceramic bypass
capacitor is required between the Vout pin and
ground near the device.
GND is the ground reference for the charge pump.
The pin must be connected to the ground plane on
the PCB.
C1+, C1- are connected to each side of the ceramic
bucket capacitor C1
C2+, C2- are connected to each side of the ceramic
bucket capacitor C2
LEDA1 – LEDC2 provide the internal regulated
current source for each of the LED cathodes. These
pins enter high-impedance zero current state
whenever the device is in shutdown mode.
TAB is the exposed pad underneath the package.
For best thermal performance, the tab should be
soldered to the PCB and connected to the ground
plane
? 2009 IXIS Corp.
Characteristics subject to change without notice
8
Doc. No. 8869_DS, Rev. N2.1
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